The wafer bonding process has many applications in the fabrication of microelectronic, optoelectronic, power and microinachined devices. In this article fu(SI)on bonding of (SI)licon, wafers and study of their interface are reported for the first time in Iran. Also, the bonding of two (SI)licon wafers, with one (or both) of the wafers having a thermally grown (SI)licon dioxide layer, has been performed and tested.